TSMC explores massive rectangular chip substrates to meet AI demand
It could translate to significantly more chips per wafer
IN A NUTSHELL: TSMC is venturing into uncharted territory with a novel approach to advanced chip packaging. The chipmaker reportedly plans to switch from conventional round wafers to rectangular substrates, allowing significantly more chips to be placed on each wafer.
The proposed rectangular substrate is currently undergoing trials. Measuring a substantial 510mm by 515mm, it reportedly boasts over three times the usable area of current round wafers. Additionally, the rectangular shape reduces wasted space around the edges. The study is still in the early stages, and its results may take a few years to reach the market.