Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

Today, the Intel Foundry Technology Research team announced technology breakthroughs in transistor, interconnects, and packaging technology, among …

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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

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